Description
Bambu Lab Bambu High Temperature Plate (Smooth PEI)
Compatibility
X1 and P1 Series
Things to know before use
- Variations in the color and luster of the Engineering Plate appearance and the removal of the exposed metal areas are just minor adjustments to optimize the production process and surface quality. If the coating remains on the nozzle when the nozzle is wiped, it will be heated and melted before printing the model. Such changes do not affect leveling, Lidar, adhesion, or range of use. You can purchase with confidence!
- Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.
- Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.
One side: Bambu High-Temperature Plate = High-Temp sheet + Bambu Engineering Plate
The other side: Bambu Engineering Plate
1.Bambu High-Temperature Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Material | Hotbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
| PLA/PLA-CF/PLA-GF | 45~60℃ | Recommended | Yes |
| ABS | 90~100℃ | Recommended | No |
| PETG | 70℃ | Yes | No |
| TPU | 35℃ | Recommended | Yes |
| ASA | 90~100℃ | Recommended | No |
| PVA | 45~60℃ | Recommended | Yes |
| PC/PC-CF | 100~110℃ | Yes | No |
| PA/PA-CF/PAHT-CF | 100~110℃ | Yes |
No |
2. Bambu Engineering Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Material | Hotbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
| TPU | 30~35℃ | Recommended | No |
| PETG | 70~80℃ | Recommended | Yes |
| ABS | 100~110℃ | Yes | No |
| PC/PC-CF | 100~110℃ | Yes | No |
| PA/PA-CF/PATH-CF | 100~110℃ | Yes | No |
Product Specification
| Surface temperature resistance | Up to 200℃ | Usable print size | 256*256 mm |
| Flexible spring steel thickness | 0.4 mm | High-temp Plate sticker thickness | 0.3 mm |
| Package Weight | 320 g | Package size | 290*290*4 mm |
